Nvidia is turning packaging, substrate and optics into the next AI bottleneck.
Nvidia signed capacity agreements with Ibiden, Samsung Electro-Mechanics and Unimicron for 2.5x substrate capacity, with Amkor expanding advanced packaging more than 300% by end-2028 and SPIL lifting co-packaged optical-engine capacity 15x by mid-2027. Korean reports say Samsung Electro-Mechanics received $830M from Tesla and $2B from Nvidia as prepayments. The constraint is shifting from wafers to physical packaging and optical interconnect.