AI capacity spending is moving into packaging, substrates and interconnect
TSMC reportedly pulled 2nm capacity to 120,000 wafers a month by year-end as major customers raised bookings 10-20%. Samsung Electro-Mechanics committed $4.4 billion to FC-BGA capacity, while networking content is modeled to rise from about $5,000 to $21,000 per GPU by Rubin Ultra. The opportunity is shifting toward packaging, substrates and interconnect; execution and new supply remain the risk.