TSM Taiwan Semiconductor Manufacturing Company Limited Loading... : Bullish and Bearish Analyst Opinions
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12:35
Sep 02
Sep 02
TSMC executive says the company's need for chipmaking tools has nearly doubled since year-end.
TSMC executive says the company's need for chipmaking tools has nearly doubled since year-end as it expands production to meet AI demand.
10:53
Sep 02
Sep 02
Supply-chain and timeline commentary on Marvell's SiPH/CPO plans.
Supply-chain and timeline commentary on Marvell's SiPH/CPO plans, with Europe/Japan sourcing noted as factual observations and no explicit positions taken by the author.
09:54
Sep 02
Sep 02
Long TSM as author core foundry holding
Long TSM as the author names it a core winner in his portfolio core focus, though lower high-beta than peers.
MED
08:23
Sep 02
Sep 02
TSMC co-chief operating officer states the company cannot secure enough construction workers.
TSMC co-chief operating officer states the company cannot secure enough construction workers in Taiwan for its operations.
07:05
Sep 02
Sep 02
TSMC COUPE not ready, still developing
TSMC’s COUPE platform is not ready and TSMC remains in development phase, pushing back on commercialization timing; no directional trade call.
LOW
05:44
Sep 02
Sep 02
TSM named for N3/N2/CoWoS.
Named as related value-chain beneficiary for advanced nodes and CoWoS packaging in the AI compute stack thesis; no explicit directional view.
MED
05:14
Sep 02
Sep 02
Author maps TSM's packaging verification line to supplier beneficiaries but frames them.
Author maps TSM's packaging verification line to supplier beneficiaries but frames them as watchlist names, not current positions or explicit buy calls.
LOW
04:57
Sep 02
Sep 02
TSMC is sticking with microbumps over hybrid bonding for HBM packaging.
TSMC is sticking with microbumps over hybrid bonding for HBM packaging, a technical roadmap update with no explicit trade position.
LOW
04:56
Sep 02
Sep 02
Watch TSM as Taiwan market excels.
Watch TSM given Taiwan market outperformance; author notes recovery but does not state a position or direction. Research/observation framing, not a long call.
MED
16:31
Sep 01
Sep 01
TSMC's CoWoS capacity is expanding toward roughly 120-140K wafers per month, narrowing the supply-demand gap from about 20% to 10%, but 2027 demand could still double and leave a 10-20% shortfall; TSM
TSMC's CoWoS capacity is expanding toward roughly 120-140K wafers per month, narrowing the supply-demand gap from about 20% to 10%, but 2027 demand could still double and leave a 10-20% shortfall; TSMC remains the key packaging bottleneck.
Risk: As packaging catches up, the bottleneck moves upstream to materials like ABF substrate, reducing TSMC's scarcity pricing even as volume grows.
05:47
Sep 01
Sep 01
TSMC identifies silicon photonics bottlenecks but the tweet is a supply-chain mapping without.
TSMC identifies silicon photonics bottlenecks but the tweet is a supply-chain mapping without explicit positions, so all tickers are watch.
LOW
04:24
Sep 01
Sep 01
TSM yield dominance kills transition photonics
Buy TSM as TSMC’s silicon photonics yield dominance is killing off NPO/LPO transition architectures, positioning it as the mainstream winner.
MED
04:03
Sep 01
Sep 01
Taiwan listing to boost TSM and TW photonics microcaps
Author believes a Taiwan listing for TSM would funnel significant liquidity into the Taiwanese market, benefiting both TSM and local photonics micro caps, which he expects to 5–10x on the wave.
MED
00:24
Sep 01
Sep 01
Author notes TSM's supply chain is entirely Taiwan-based.
Author notes TSM's supply chain is entirely Taiwan-based, expressing geographic risk concern without a directional trade call.
LOW
23:28
Aug 31
Aug 31
TSMC highlights substrate bottleneck after memory
Watch TSMC as the author cites its commentary on substrate bottlenecks as context for MediaTek's funding actions; research framing without explicit position.
MED
23:01
Aug 31
Aug 31
TSMC sees 24x token growth by 2030
TSMC forecasts token consumption to grow 24x to 120 quadrillion tokens by 2030 and data center power capacity additions to rise to 30–40GW/year for 2025–30; no directional trade view expressed.
LOW
22:49
Aug 31
Aug 31
TSM leads as packaging constraints drive AI demand
Buy TSM as record earnings and 50% higher employee bonuses confirm strong AI-driven demand; the real bottleneck is packaging/interconnect, favoring TSM's advanced packaging and OSAT/specialty substrate partners.
HIGH
22:43
Aug 31
Aug 31
The author maps the AI infrastructure value chain from GPUs to power and optics.
The author maps the AI infrastructure value chain from GPUs to power and optics, but frames it as a research overview rather than stating any personal positions or forward calls.
22:29
Aug 31
Aug 31
The tweet is a factual supply-chain analysis of Taiwan's CPO ecosystem beneficiaries.
The tweet is a factual supply-chain analysis of Taiwan's CPO ecosystem beneficiaries, not an expression of any directional position or trade call.
LOW
15:05
Aug 31
Aug 31
AI semiconductor spend runs through 2030
CJ Muse argues AI infrastructure spending is durable through at least 2030. TSMC is effectively sold out until 2029, memory is similarly tight, and NVIDIA can only meet about 70% of 2027 demand. If this cycle extends beyond 2028, semiconductor stocks are incredibly cheap.
HIGH
14:52
Aug 31
Aug 31
TSMC ecosystem entrenchment noted
Notes TSMC PDK/IP and CoWoS packaging are deeply embedded in accelerator supply chain, creating switching costs; no explicit stock direction.
MED
14:51
Aug 31
Aug 31
TSMC outsources CoWoS back-end to Intel
Reports TSMC shifted part of CoWoS back-end orders to Intel Malaysia after AI-chip orders strained CoWoS capacity; no directional view stated.
MED
14:51
Aug 31
Aug 31
Author notes TSM's local sourcing preference and contrasts Taiwan silicon photonics strength.
Author notes TSM's local sourcing preference and contrasts Taiwan silicon photonics strength with US names pulling back, framing it as market observation rather than a trade call.
LOW
14:03
Aug 31
Aug 31
Intel's EMIB-T packaging roadmap is presented as a factual technology and revenue.
Intel's EMIB-T packaging roadmap is presented as a factual technology and revenue diversification update, not an explicit position or trade call.
13:57
Aug 31
Aug 31
TSMC benefits from custom XPU demand
Buy TSMC on higher demand for leading-edge wafers and advanced packaging driven by custom XPU growth.
MED
13:39
Aug 31
Aug 31
TSM confirmed for HBM4 base-die production
Notes SK Hynix is outsourcing HBM4 base-die production to TSM's 12nm-class process, confirming TSM's role in the growing HBM supply chain as base-die logic becomes more sophisticated.
LOW
10:55
Aug 31
Aug 31
Watch TSM on silicon photonics mainstream adoption
Watch TSM as silicon photonics goes mainstream by 2027 with over 50% optical transceiver market share. Supply-chain read-through, not an author position.
MED
19:02
Aug 30
Aug 30
Elon Musk's AI infrastructure push via turbine blades for power is framed as a broad.
Elon Musk's AI infrastructure push via turbine blades for power is framed as a broad beneficiary map for chip and AI names, not an explicit position.
LOW
16:15
Aug 30
Aug 30
AI semiconductor manufacturing leader top position
Druckenmiller holds Taiwan Semiconductor Manufacturing as his second-largest position; it is the AI-driven semiconductor manufacturer and a direct way to play AI chip demand.
LOW
11:16
Aug 30
Aug 30
Author sees AI bubble pockets but views the structural NVDA/TSM-led AI supercycle as durable.
Author sees AI bubble pockets but views the structural NVDA/TSM-led AI supercycle as durable, framing it as a factual thesis rather than a fresh position.
LOW
About TSM Analyst Coverage
Buzzberg tracks TSM (Taiwan Semiconductor Manufacturing Company Limited) across 140 sources. 292 bullish vs 5 bearish calls from 265 analysts. Sentiment: predominantly bullish (24%). 1217 total trade ideas tracked. Past 7 days: 11 bullish, 35 watch. Latest voices: Bloomberg, aleabitoreddit, FirstSquawk.