BESI BE Semiconductor Industries N.V. Loading... : Bullish and Bearish Analyst Opinions
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10:01
Jul 18
Jul 18
Co-mentioned as key enabler of hybrid bonding for 3D die stacking and next-generation HBM memory packaging.
MED
09:53
Jul 18
Jul 18
Author identifies BESI as a hybrid bonding specialist enabling 3D chip architectures, with HBM memory as a key driver of this technology's commercial adoption.
LOW
09:20
Jul 09
Jul 09
The author lists 15 datacenter buildout stocks as dip-buy candidates but frames them as a research watchlist rather than stating personal positions or explicit forward calls.
LOW
13:16
Jun 22
Jun 22
The author celebrates a 104% gain on their BESI position, confirming they are long and profitable on the stock.
14:06
Jun 19
Jun 19
Long BESI; author explicitly states they hold a position. BESI is a hybrid bonding equipment player, a key enabling technology in advanced semiconductor packaging, making it a direct beneficiary of next-generation chip interconnect trends.
MED
13:35
Jun 19
Jun 19
Long BESI as the author's held pure-play advanced packaging equipment name. Advanced packaging solves AI accelerator bandwidth constraints by co-locating HBM with compute via dense interconnects — BESI is the author's highest-conviction equipment exposure to this structural trend.
MED
14:50
Jun 18
Jun 18
The author states they only hold TSMC and BESI at all-time highs, implying a passive holding stance without a forward-looking trade call.
LOW
14:03
Jun 17
Jun 17
Co-mentioned alongside KLIC as hybrid bonding trend names in an upcoming thematic report; no individual thesis provided.
LOW
00:56
Jun 17
Jun 17
Author lists hot earnings names with valuation ignored but provides no personal position or forward call, making this a research watchlist.
LOW
10:03
Jun 10
Jun 10
Watch BESI as its jointly developed Kinex hybrid bonding cluster with AMAT is reportedly being adopted in mass production lines at Samsung and SK Hynix — no author position disclosed.
MED
07:58
Jun 09
Jun 09
Reports $5B additional spending needed for EMIB facility (likely Intel), implying increased demand for Besi’s equipment – fundamental catalyst noted.
MED
23:32
Jun 03
Jun 03
The author agrees that Besi will perform well but does not state a personal position or forward-looking trade call.
LOW
22:43
May 27
May 27
Watch BESI as a medium-magnitude beneficiary of AI-driven advanced packaging complexity, with die-attach and hybrid bonding exposure to chiplet, photonic engine, and scale-up interconnect architectures.
MED
19:00
May 23
May 23
Long BESI on its critical role in integrating photonic chips with switch ASICs for CPO architectures.
HIGH
23:45
May 19
May 19
Author provides a personal portfolio update detailing recent sales and reduced positions for cash management, with no explicit forward-looking bullish or bearish trade calls on any ticker.
HIGH
16:44
May 17
May 17
The author argues that several AI supply chain names like Pillar Corp, Kokusai Electric, LandMark Opto, and KLIC are mispriced due to overlooked structural tailwinds from HBM and advanced packaging intensity.
HIGH
00:05
May 15
May 15
Long BESI on exposure to hybrid bonding and advanced packaging inflections driven by AI accelerator scaling.
HIGH
14:45
May 07
May 07
Bearish view on BESI and ASMPT as KLIC's competitive TCB platform gains share, compressing order visibility and pricing power for incumbent tool suppliers.
HIGH
12:30
May 06
May 06
Long BESI as a broader assembly equipment beneficiary of OSAT advanced packaging capacity expansion for AI accelerators.
HIGH
02:42
May 06
May 06
The tweet sarcastically lists a large portfolio of semiconductor and tech stocks to mock those who don't own them, implying a bearish outlook on being left behind in the market.
HIGH
15:54
May 05
May 05
Author discloses a current, sizeable long position in BE Semiconductor Industries alongside semiconductor equipment peers ONTO and PDFS.
MED
22:52
May 04
May 04
Long beneficiaries of CPO adoption including Broadcom, Marvell, TSMC, ASE, Amkor, BESI, ASMPT, Coherent, and Lumentum, as advanced packaging and optical integration become strategic.
HIGH
07:40
May 04
May 04
BESI's CEO confirms Samsung's hybrid bonding adoption is on track despite JEDEC height limit talks, with mass production expected next year driven by NVIDIA's demand for advanced HBM.
HIGH
13:32
Apr 30
Apr 30
Long BESI on hybrid bonding and advanced packaging becoming front-end-like in precision.
MED
20:12
Apr 28
Apr 28
Long BESI as a European semi-equipment play with hybrid bonding for HBM4 and 3D logic, driven by hyperscaler orders.
HIGH
15:02
Apr 28
Apr 28
Long BESI as a hybrid bonding leader, benefiting from advanced packaging tool demand and high attach rates per wafer.
HIGH
12:29
Apr 26
Apr 26
Long BESI as TSMC increases SoIC orders, which should boost demand for BE Semiconductor's advanced packaging equipment.
HIGH
16:31
Apr 24
Apr 24
Buy $BESI as the monopoly vendor for vertical stacking in semiconductor scaling, analogous to ASML's EUV monopoly in 2018.
MED
01:29
Apr 23
Apr 23
Long OSAT and test equipment companies as external tightness in assembly, test, and back-end semiconductor capacity creates a positive near-term environment for these outsourced providers.
MED
04:28
Apr 17
Apr 17
Article uses Besi (at 82x EV/EBITDA) as the high-multiple benchmark for advanced packaging; the thesis hinges on European photonics stocks re-rating toward Besi’s multiple. This indirectly validates B
Article uses Besi (at 82x EV/EBITDA) as the high-multiple benchmark for advanced packaging; the thesis hinges on European photonics stocks re-rating toward Besi’s multiple. This indirectly validates Besi’s premium valuation and its positioning as the leader in the space.
Risk: If the European names re-rate, it doesn't change Besi’s own fundamentals; the comparison could also highlight overvaluation risk.
About BESI Analyst Coverage
Buzzberg tracks BESI (BE Semiconductor Industries N.V.) across 15 sources. 10 bullish vs 0 bearish calls from 15 analysts. Sentiment: predominantly bullish (26%). 39 total trade ideas tracked. Past 7 days: 2 watch. Latest voices: frenchie_, tacticzh, julientechinvst.