TSM Taiwan Semiconductor Manufacturing Company Limited Загрузка... : Бычьи и медвежьи мнения аналитиков
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Лучшие сигналы
Лента
12:35
02 сен
02 сен
TSMC executive says the company's need for chipmaking tools has nearly doubled since year-end.
TSMC executive says the company's need for chipmaking tools has nearly doubled since year-end as it expands production to meet AI demand.
10:53
02 сен
02 сен
Supply-chain and timeline commentary on Marvell's SiPH/CPO plans.
Supply-chain and timeline commentary on Marvell's SiPH/CPO plans, with Europe/Japan sourcing noted as factual observations and no explicit positions taken by the author.
09:54
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02 сен
Long TSM as author core foundry holding
Long TSM as the author names it a core winner in his portfolio core focus, though lower high-beta than peers.
Сред.
08:23
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02 сен
TSMC co-chief operating officer states the company cannot secure enough construction workers.
TSMC co-chief operating officer states the company cannot secure enough construction workers in Taiwan for its operations.
07:05
02 сен
02 сен
TSMC COUPE not ready, still developing
TSMC’s COUPE platform is not ready and TSMC remains in development phase, pushing back on commercialization timing; no directional trade call.
Низ.
05:44
02 сен
02 сен
TSM named for N3/N2/CoWoS.
Named as related value-chain beneficiary for advanced nodes and CoWoS packaging in the AI compute stack thesis; no explicit directional view.
Сред.
05:14
02 сен
02 сен
Author maps TSM's packaging verification line to supplier beneficiaries but frames them.
Author maps TSM's packaging verification line to supplier beneficiaries but frames them as watchlist names, not current positions or explicit buy calls.
Низ.
04:57
02 сен
02 сен
TSMC is sticking with microbumps over hybrid bonding for HBM packaging.
TSMC is sticking with microbumps over hybrid bonding for HBM packaging, a technical roadmap update with no explicit trade position.
Низ.
04:56
02 сен
02 сен
Watch TSM as Taiwan market excels.
Watch TSM given Taiwan market outperformance; author notes recovery but does not state a position or direction. Research/observation framing, not a long call.
Сред.
16:31
01 сен
01 сен
TSMC's CoWoS capacity is expanding toward roughly 120-140K wafers per month, narrowing the supply-demand gap from about 20% to 10%, but 2027 demand could still double and leave a 10-20% shortfall; TSM
TSMC's CoWoS capacity is expanding toward roughly 120-140K wafers per month, narrowing the supply-demand gap from about 20% to 10%, but 2027 demand could still double and leave a 10-20% shortfall; TSMC remains the key packaging bottleneck.
Risk: As packaging catches up, the bottleneck moves upstream to materials like ABF substrate, reducing TSMC's scarcity pricing even as volume grows.
05:47
01 сен
01 сен
TSMC identifies silicon photonics bottlenecks but the tweet is a supply-chain mapping without.
TSMC identifies silicon photonics bottlenecks but the tweet is a supply-chain mapping without explicit positions, so all tickers are watch.
Низ.
04:24
01 сен
01 сен
TSM yield dominance kills transition photonics
Buy TSM as TSMC’s silicon photonics yield dominance is killing off NPO/LPO transition architectures, positioning it as the mainstream winner.
Сред.
04:03
01 сен
01 сен
Taiwan listing to boost TSM and TW photonics microcaps
Author believes a Taiwan listing for TSM would funnel significant liquidity into the Taiwanese market, benefiting both TSM and local photonics micro caps, which he expects to 5–10x on the wave.
Сред.
00:24
01 сен
01 сен
Author notes TSM's supply chain is entirely Taiwan-based.
Author notes TSM's supply chain is entirely Taiwan-based, expressing geographic risk concern without a directional trade call.
Низ.
23:28
31 авг
31 авг
TSMC highlights substrate bottleneck after memory
Watch TSMC as the author cites its commentary on substrate bottlenecks as context for MediaTek's funding actions; research framing without explicit position.
Сред.
23:01
31 авг
31 авг
TSMC sees 24x token growth by 2030
TSMC forecasts token consumption to grow 24x to 120 quadrillion tokens by 2030 and data center power capacity additions to rise to 30–40GW/year for 2025–30; no directional trade view expressed.
Низ.
22:49
31 авг
31 авг
TSM leads as packaging constraints drive AI demand
Buy TSM as record earnings and 50% higher employee bonuses confirm strong AI-driven demand; the real bottleneck is packaging/interconnect, favoring TSM's advanced packaging and OSAT/specialty substrate partners.
Выс.
22:43
31 авг
31 авг
The author maps the AI infrastructure value chain from GPUs to power and optics.
The author maps the AI infrastructure value chain from GPUs to power and optics, but frames it as a research overview rather than stating any personal positions or forward calls.
22:29
31 авг
31 авг
The tweet is a factual supply-chain analysis of Taiwan's CPO ecosystem beneficiaries.
The tweet is a factual supply-chain analysis of Taiwan's CPO ecosystem beneficiaries, not an expression of any directional position or trade call.
Низ.
15:05
31 авг
31 авг
AI semiconductor spend runs through 2030
CJ Muse argues AI infrastructure spending is durable through at least 2030. TSMC is effectively sold out until 2029, memory is similarly tight, and NVIDIA can only meet about 70% of 2027 demand. If this cycle extends beyond 2028, semiconductor stocks are incredibly cheap.
Выс.
14:52
31 авг
31 авг
TSMC ecosystem entrenchment noted
Notes TSMC PDK/IP and CoWoS packaging are deeply embedded in accelerator supply chain, creating switching costs; no explicit stock direction.
Сред.
14:51
31 авг
31 авг
TSMC outsources CoWoS back-end to Intel
Reports TSMC shifted part of CoWoS back-end orders to Intel Malaysia after AI-chip orders strained CoWoS capacity; no directional view stated.
Сред.
14:51
31 авг
31 авг
Author notes TSM's local sourcing preference and contrasts Taiwan silicon photonics strength.
Author notes TSM's local sourcing preference and contrasts Taiwan silicon photonics strength with US names pulling back, framing it as market observation rather than a trade call.
Низ.
14:03
31 авг
31 авг
Intel's EMIB-T packaging roadmap is presented as a factual technology and revenue.
Intel's EMIB-T packaging roadmap is presented as a factual technology and revenue diversification update, not an explicit position or trade call.
13:57
31 авг
31 авг
TSMC benefits from custom XPU demand
Buy TSMC on higher demand for leading-edge wafers and advanced packaging driven by custom XPU growth.
Сред.
13:39
31 авг
31 авг
TSM confirmed for HBM4 base-die production
Notes SK Hynix is outsourcing HBM4 base-die production to TSM's 12nm-class process, confirming TSM's role in the growing HBM supply chain as base-die logic becomes more sophisticated.
Низ.
10:55
31 авг
31 авг
Watch TSM on silicon photonics mainstream adoption
Watch TSM as silicon photonics goes mainstream by 2027 with over 50% optical transceiver market share. Supply-chain read-through, not an author position.
Сред.
19:02
30 авг
30 авг
Elon Musk's AI infrastructure push via turbine blades for power is framed as a broad.
Elon Musk's AI infrastructure push via turbine blades for power is framed as a broad beneficiary map for chip and AI names, not an explicit position.
Низ.
16:15
30 авг
30 авг
AI semiconductor manufacturing leader top position
Druckenmiller holds Taiwan Semiconductor Manufacturing as his second-largest position; it is the AI-driven semiconductor manufacturer and a direct way to play AI chip demand.
Низ.
11:16
30 авг
30 авг
Author sees AI bubble pockets but views the structural NVDA/TSM-led AI supercycle as durable.
Author sees AI bubble pockets but views the structural NVDA/TSM-led AI supercycle as durable, framing it as a factual thesis rather than a fresh position.
Низ.
Об аналитическом покрытии TSM
Buzzberg отслеживает TSM (Taiwan Semiconductor Manufacturing Company Limited) в 140 источниках. Бычьих сигналов: 292, медвежьих: 5, от 265 аналитиков. Сентимент преимущественно бычий (24%). Всего отслеживается 1217 торговых идей. За последние 7 дней: бычьих: 11, наблюдение: 35. Последние спикеры: Bloomberg, aleabitoreddit, FirstSquawk.