MicroLED: The Optical Technology All Three Memory Makers Are Watching
Damnang
· Damnang’s Substack
· June 04, 2026 at 08:01
· ⏱ 10 min read
| Read on Substack ↗
Summary
The article argues that MicroLED-based optical interconnects (Avicena's LightBundle technology) offer a low-power, high-bandwidth alternative to laser-based optics for memory-to-compute links, and that the simultaneous investment by all three memory makers (Samsung, SK hynix, Micron) signals the technology's potential to reshape datacenter interconnect. For markets, this highlights TSMC and ams OSRAM as key manufacturing partners and Micron as a potential beneficiary of the trend toward low-power optical links.
•Avicena, a private startup, has all three memory makers (Samsung, SK hynix, Micron) on its cap table, plus investments from TSMC's VC arm, Tiger Global, and Lam Research.
•LightBundle uses hundreds of blue GaN MicroLEDs (like a tiny display) and a matching photodetector array (like a camera) to achieve 3 Tbps over 10+ meters using 300 lanes at 10 Gbps each.
•The architecture eliminates lasers (improving reliability and temperature tolerance up to 235°C), removes the need for SerDes and FEC, and achieves sub-pJ/bit full-link energy, far below laser-based alternatives.
•Avicena demonstrated 4 Gbps per lane at 100 µA drive current with 1E-12 BER without FEC, translating to 80 fJ/bit transmit energy.
•The company has a joint development agreement with ams OSRAM for GaN MicroLED volume manufacturing and a collaboration with TSMC to use CMOS image sensor processes for photodetector arrays.
•In March 2026, Avicena launched the LightBundle eKit, the industry's first MicroLED optical communications evaluation platform, including an ASIC transceiver and multicore fiber bundle.
TSMC has a collaboration with Avicena to use its CMOS image sensor (CIS) processes to optimize and mass-produce photodetector arrays for the LightBundle platform. This positions TSMC as the foundry pa
TSMC has a collaboration with Avicena to use its CMOS image sensor (CIS) processes to optimize and mass-produce photodetector arrays for the LightBundle platform. This positions TSMC as the foundry partner for a potentially disruptive optical interconnect technology, adding a new revenue stream in advanced packaging.
Risk: Technology adoption timeline is uncertain; Avicena is private and revenue-generating milestones not yet proven.
Micron participated in Avicena's Series A ($25M) alongside Samsung and is now evaluating MicroLED for memory optical interconnects. As one of the three memory makers, adoption of this low-power interc
Micron participated in Avicena's Series A ($25M) alongside Samsung and is now evaluating MicroLED for memory optical interconnects. As one of the three memory makers, adoption of this low-power interconnect would be a competitive advantage for HBM and future memory fabric, given the power and bandwidth limitations of electrical and laser-based links.
Risk: Avicena's technology is still in evaluation phase; mass deployment in memory products is speculative and would require significant integration.