"Amazon CapEx looks to be up about 50%. Meta... 75%, and Google... closer to a 100%... I would expect their AI spend to grow at a rate that's that's north of that." + "NVIDIA has done a better job than anyone else in terms of signing up procurement." The market fears hyperscalers (GOOGL, META) will shift to internal chips (ASICs) or competitors (AMD). However, the supply chain for critical components (CoWoS, HBM) is constrained until 2027. Since Nvidia secured this capacity early, competitors physically cannot manufacture enough chips to take meaningful market share, regardless of their chip design quality. Long. The setup mirrors last year: fears of competition are overblown because supply, not demand, is the constraint. Valuation is attractive at ~20x earnings with a potential expansion to 30x. Unexpected alleviation of supply chain constraints allowing competitors to scale faster; China export restrictions tightening further.
"We've got some component shortages that don't look like they're being alleviated... Through '27. So whether it's, the TSM with CoWoS or WaferSupply, whether it's, HBM DRAM." The entire AI ecosystem is bottlenecked by specific physical components: Advanced Packaging (TSMC's CoWoS) and High Bandwidth Memory (HBM). If shortages are projected through 2027, the manufacturers of these components possess immense pricing power and revenue visibility, independent of which specific GPU designer (Nvidia vs. AMD) wins. Long the "bottleneck" providers. Massive capacity expansion leading to oversupply post-2027; technological shifts rendering current HBM/CoWoS standards obsolete.