Nvidia – The Inference Kingdom Expands

Dylan Patel · SemiAnalysis · 24 марта 2026, 00:27 · ⏱ 34 мин чтения  | Читать в Substack ↗
Резюме
Nvidia's GTC 2026 reveals a multi-pronged strategy to extend its inference dominance: integrating Groq's LPU for low-latency decode via attention-FFN disaggregation, scaling rack systems from copper to CPO (Rubin Ultra NVL576, Feynman NVL1152), and pushing into storage with CMX/STX. The article argues Nvidia's co-packaged optical ramp and dense CPU racks (Vera ETL256) will pressure incumbent networking and memory suppliers while creating new foundry demand for TSMC's advanced packaging.
  • Nvidia structured its $20B Groq 'acquisition' as an IP license/hire to avoid antitrust; Groq's LPU 3 (LP30) will be fabricated on Samsung SF4, while the next-gen LP40 moves to TSMC N3P with CoWoS-R and hybrid bonded DRAM from SK Hynix.
  • Attention-FFN disaggregation (AFD) maps attention to GPUs (stateful, high HBM) and FFN to LPUs (stateless, high SRAM bandwidth) to improve decode latency and throughput for sparse MoE models.
  • LPX rack has 32 compute trays, each with 16 LPUs, 2 Altera FPGAs (acting as NIC, PCIe bridge, and extra DDR5 pool), and a Granite Rapids host CPU; intra-node all-to-all C2C uses 4x100G per LPU via PCB traces.
  • CPO debut is deferred to Rubin Ultra NVL576 (8 Oberon racks, two-tier all-to-all with CPO between racks) and Feynman NVL1152 (8 Kyber racks, CPO for inter-rack but copper within rack for now); Jensen hinted Feynman could be 'all CPO'.
  • Vera ETL256 packs 256 CPUs per rack using 32 compute trays, Spectrum-X 4-switch multiplane topology, all-copper intra-rack, and liquid cooling; rationale is cost savings from eliminating optics on the spine.
  • STX reference storage rack uses BF-4 DPUs with Vera CPU, dual CX-9 NICs, and SOCAMMs; Nvidia named 15 storage vendors as STX supporters, signaling push into infrastructure software layer.
  • Nvidia's Kyber rack for Rubin Ultra NVL144 has 36 compute blades (4 GPUs + 2 Vera each), 72 NVLink 7 switches, and uses copper flyover cables to midplane; no CPO within rack.
  • NVLink 7 switch expected to double bandwidth and radix vs NVLink 6 to enable all-to-all NVL288, but current supply chain evidence is mixed; NVL288 may require oversubscription without higher-radix switch.
Время чтения 34 мин
Объём 34,431 симв.
Категория finance
Идеи
Dylan Patel Основатель, CEO и главный аналитик SemiAnalysis
Nvidia's LP40 moves to TSMC N3P with CoWoS-R, and the article states 'TSMC’s N3 ... is putting a cap on accelerator production' — TSMC's advanced node and packaging capacity is a bottleneck, giving it
Nvidia's LP40 moves to TSMC N3P with CoWoS-R, and the article states 'TSMC’s N3 ... is putting a cap on accelerator production' — TSMC's advanced node and packaging capacity is a bottleneck, giving it pricing power and high utilization. Risk: Geopolitical risk on Taiwan; potential shift to Samsung for some nodes (LP30 on SF4) could dilute TSMC's share.
Dylan Patel Основатель, CEO и главный аналитик SemiAnalysis
Altera FPGAs (now part of Intel) serve as 'Fabric Expansion Logic' in every LPX compute tray, handling NIC conversion, PCIe bridging, and extra DDR5 memory — this is a new, high-volume design win for
Altera FPGAs (now part of Intel) serve as 'Fabric Expansion Logic' in every LPX compute tray, handling NIC conversion, PCIe bridging, and extra DDR5 memory — this is a new, high-volume design win for Intel's programmable logic business. Risk: Intel's Altera unit faces competition from Xilinx/AMD; Nvidia could in-source FPGA functionality in future generations.
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