Massive DRAM capacity expansion plans by Samsung and SK hynix will drive strong demand for semiconductor equipment. Wonik IPS (front-end equipment), PSK (memory process equipment), and HPSP (high-pressure anneal for DRAM) are early beneficiaries with growing order momentum, making them attractive plays on the memory capex cycle.
Massive DRAM capacity expansion plans by Samsung and SK hynix will drive strong demand for semiconductor equipment. Wonik IPS (front-end equipment), PSK (memory process equipment), and HPSP (high-pressure anneal for DRAM) are early beneficiaries with growing order momentum, making them attractive plays on the memory capex cycle.