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Everyone is chasing the models. The better question is who sells the shovels.
The AI gold rush is loud. The shovel sellers are quiet. They do not need the models to become conscious, replace humanity, or cure cancer. They just need them to keep needing more power, more memory, more cooling, more networking, more concrete, and more pipes to move the tokens.
That is what Jensen Huang keeps mapping out every time he takes the stage. The obvious trade is NVIDIA. The more interesting trade may be the stack of companies underneath it: the HBM suppliers, the rack builders, the liquid cooling names, the cloud landlords, the optical networking vendors, the power equipment makers, the EDA software vendors, the hidden ceramics suppliers, and the software layers that let AI agents do useful work.
In every gold rush, the crowd chases the gold. The smarter money studies the shovels.
# The Huang Grade Framework
Not every AI-adjacent company deserves the same weight. Some companies get directly named by Jensen. Some are official NVIDIA partners or suppliers. Some are second-order read-throughs. Some are weird hidden shovel plays that sound like jokes until you realize they make critical parts buried inside the machine.
That is where the Huang Grade comes in.
|Grade|Meaning|Signal Strength|
|:-|:-|:-|
|**A+**|Jensen directly praises with strong language|Highest immediate reaction|
|**A**|Direct NVIDIA partner/supplier/customer or very clear revenue link|Strong and fast|
|**B+**|Critical hidden shovel with real supply-chain linkage|High if market connects dots|
|**B**|Strong second-order infrastructure read-through|Reliable but slower|
|**C**|Broad thematic exposure, weaker linkage|Noisier|
|**D**|Weak monetization link|Low conviction|
|**F**|Forced ticker stretch|Avoid|
# Individual Stock Huang Grade Table
|Rank|Company|Ticker|Primary Layer|Huang Grade|Key Rationale|Notes / Catalyst|
|:-|:-|:-|:-|:-|:-|:-|
|1|**NVIDIA**|NVDA|Full-Stack Seller|**A+**|Narrates and enables the whole AI factory buildout: Vera Rubin, Vera CPU, RTX Spark, Agent Toolkit|The mothership; both prospector and shovel seller|
|2|**TSMC**|TSM / "2330.TW|Foundry / Packaging|**A**|Vera Rubin starts at TSMC; 3nm and CoWoS linkage|Direct keynote supply-chain callout|
|3|**Vertiv**|VRT|Cooling / Power|**A**|Leading liquid cooling and data-center power infrastructure exposure|Not necessarily direct keynote name, but A-tier physical shovel|
|4|**Cadence**|CDNS|EDA / Chip Design|**A**|NVIDIA-Cadence chip-design super-agent partnership|Direct dedicated keynote section|
|5|**CoreWeave**|CRWV|AI Cloud|**A**|Named as fast-growing NVIDIA AI cloud partner with Vera Rubin engineering racks|Direct ecosystem winner|
|6|**Arista Networks**|ANET|Networking Fabric|**A- / B+**|Critical AI cluster networking exposure|Strong shovel, but more second-order unless directly named|
|7|**Applied Materials**|AMAT|Semiconductor Capital Equipment|**B+**|Deposition/materials engineering for advanced AI chip production|“Picks inside the picks” exposure|
|8|**Lam Research**|LRCX|Semiconductor Capital Equipment|**B+**|Etch/deposition leverage to HBM and advanced nodes|Strong AI semi-capex passthrough|
|9|**Eaton**|ETN|Power / Electrical|**B+**|Power management, switchgear, electrical infrastructure|Clean data-center power shovel|
|10|**MediaTek**|"2454.TW|Edge / On-Device AI|**B+ / A-**|RTX Spark chip partnership with NVIDIA|Direct platform linkage|
|11|**Micron**|MU|HBM / Memory|**B+ / A-**|HBM supplier for AI GPUs|Direct memory-bandwidth beneficiary|
|12|**Samsung Electronics**|005930.KS|HBM / Memory|**B+ / A-**|HBM4 supplier for Vera Rubin|Direct supply-chain callout|
|13|**SK hynix**|000660.KS|HBM / Memory|**B+ / A-**|Key HBM supplier|Direct supply-chain callout|
|14|**Dell**|DELL|Physical Infrastructure / Racks|**B+ / A-**|Vera Rubin NVL72 engineering-rack partner|Directly congratulated in keynote|
|15|**Generac**|GNRC|Backup Power|**B+**|Backup generation and reliability for hyperscale data centers|Elevated by hyperscaler supply-deal catalyst in your uploaded table|
|16|**Nebius**|NBIS|AI Cloud|**B+ / A-**|Named as fast-growing NVIDIA AI cloud partner|Direct keynote ecosystem winner|
|17|**Broadcom**|AVGO|Networking / Custom Silicon|**B+**|Custom ASICs, networking, AI fabric exposure|Strong second-order shovel|
|18|**ServiceNow**|NOW|Agent Software / Runtime|**B**|Enterprise agentic AI software partner|Real narrative, less direct than hardware|
|19|**ASML**|ASML|Semiconductor Capital Equipment|**B+**|EUV monopoly for leading-edge chips|High-moat, obvious, expensive shovel|
|20|**TOTO**|5332.T / TOTDY|Hidden Semiconductor Tooling|**B+**|Advanced ceramics / electrostatic chucks for semiconductor manufacturing|Best “wait, the toilet company is an AI shovel?” angle|
|21|**Ibiden**|4062.T|Advanced Packaging / Substrates|**B+**|Advanced substrates for AI server and high-performance chip packaging|Hidden bottleneck exposure|
|22|**Unimicron**|"3037.TW|Advanced Packaging / Substrates|**B**|Major substrate manufacturer|Advanced packaging passthrough|
|23|**CrowdStrike**|CRWD|Agent Software / Security|**C+ / B-**|Named in enterprise agentic AI group|Real but more application-layer|
|24|**Palantir**|PLTR|Enterprise AI / Agents|**C+ / B-**|Named in enterprise AI/software group|More application layer than core physical infrastructure|
|25|**Synopsys**|SNPS|EDA / Chip Design|**B**|EDA-adjacent read-through from Cadence chip-design agent thesis|Not direct in original keynote table|
|26|**Marvell**|MRVL|Networking / Custom Silicon|**A+ event / B+ stack**|Separate Jensen/Computex catalyst; AI networking fabric exposure|Belongs in “broader Huang tracker,” not original keynote-only list|
|27|**Cloudflare**|NET|Edge / Infra / Security|**B**|Crowd-surfaced AI infrastructure read-through|Not direct; useful second-order idea|
|28|**SK Telecom**|SKM|AI Proxy / Anthropic Read-through|**C+ / B-**|Crowd-surfaced; tied more to Anthropic/AI proxy narrative|Not a clean shovel unless catalyst is separately proven|
# AI Shovel Stack Table
|Layer|The Shovels|Key Tickers / Candidates|Huang Grade Range|Why They Matter|Story Potential|
|:-|:-|:-|:-|:-|:-|
|**Power**|Grid power, backup generation, power electronics, transformers, switchgear, energy storage|VST, CEG, NRG, ETN, GEV, GNRC, PWR|**B to B+**|AI factories are measured in gigawatts. Reliability and backup power are now critical-path requirements.|The most boring and most essential layer.|
|**Cooling**|Liquid cooling, cold plates, immersion cooling, heat exchangers, thermal management|VRT, CARR, TT, nVent|**A to B+**|Air cooling cannot scale cleanly at current AI rack densities.|Heat, pipes, coolant loops, and thermal reality.|
|**Memory & Advanced Packaging**|HBM, CoWoS, interposers, glass/organic substrates|MU, Samsung, SK hynix, TSMC, Unimicron, Ibiden, Shinko|**A to B+**|Memory bandwidth and packaging are core constraints.|HBM is the blood of the machine.|
|**Semiconductor Capital Equipment & Tooling**|Lithography, deposition, etch, inspection, metrology, electrostatic chucks, precision ceramics|AMAT, LRCX, ASML, KLAC, TOTO, Kyocera, NTK|**B to B+**|AI chips cannot exist without the tools and hidden components that manufacture them.|“Picks inside the picks.”|
|**Networking Fabric**|High-speed switches, optics, NICs, DPUs, NVLink, Ethernet fabrics|NVDA, ANET, AVGO, MRVL, CIEN|**A to B+**|At pod and rack scale, networking becomes a primary bottleneck.|The hidden traffic jam between GPUs.|
|**Physical Infrastructure & Racks**|ODMs, rack builders, server makers, bus bars, power delivery, data-center construction|DELL, Quanta, Foxconn, Celestica, SMCI|**A to B**|Someone must physically build and wire the AI factories.|The revolution still arrives by forklift.|
|**AI Clouds & Compute Rental**|GPU clouds, inference platforms, managed AI infrastructure|CRWV, NBIS, Together AI, Fireworks, regional AI clouds|**A to B+**|If compute is revenue, AI clouds are toll booths.|The miners rent their shovels by the hour.|
|**EDA & Chip Design Software**|Verification, simulation, design automation, chip-design agents|CDNS, SNPS|**A to B**|Faster design and verification accelerates the AI chip cycle.|Software shovels that design hardware shovels.|
|**Agent Software & Runtime Layer**|Agent harnesses, tool-use frameworks, orchestration, secure sandboxes, enterprise agent platforms|MSFT, NOW, SAP, CRWD, PLTR, ADBE, NVIDIA OpenShell / Agent Toolkit|**B to C+**|When AI shifts from chat to agents, software becomes something agents actively operate.|The new operating system for work.|
|**Physical AI & Robotics Infrastructure**|World models, simulation platforms, humanoid reference designs, edge robotics computers|NVIDIA Cosmos, Isaac GR00T, Jetson Thor|**B / early**|Robotics needs simulation, synthetic data, and edge hardware.|High upside, longer-dated frontier.|
|**Edge / On-Device AI Hardware**|AI PCs, edge AI computers, robotics computers|MediaTek, NVIDIA Jetson, RTX Spark ecosystem|**A- to B+**|AI expands beyond cloud into devices, PCs, and robots.|Consumer + industrial edge story.|
|**Full-Stack Seller**|GPUs, CPUs, networking, software stack, AI factory reference designs, agent toolkits|NVDA|**A+**|NVIDIA is designing the whole AI industrial base.|Owner of the mining camp.|
# Strategic Takeaways
* The "A-Tier" is Unapologetic: NVIDIA, TSMC, Vertiv, and CoreWeave are no longer speculative; they are the physical realities of the compute rollout.
* The GNRC Catalyst: Generac’s June 2nd hyperscaler deal officially elevates them to a B+ infrastructure play, proving backup generation is now a critical path constraint for AI factories.
* Hunt for Hidden Alpha: As the primary trade gets crowded, the smartest money is moving into the "Picks Inside the Picks." Companies like TOTO (ceramics) and Ibiden (substrates) offer supply-chain choke-point exposure without the retail premium.
* Software Lags Hardware: The enterprise software layer (NOW, CRWD) remains in the B/C range. Their narrative is real, but until agent toolkits drive measurable seat-license expansion, hardware remains the cleaner infrastructure play.
The direct names get the immediate Jensen bump. The hidden shovels may be where the longer-term alpha lives.
So help me build the shovel map. What are the weird public companies buried two or three layers deep in the AI supply chain that most regards are still missing?
And yes, all the AIs were consulted while compiling this list. That’s kind of the point.