Intel & SK Hynix collaborate on EMIB Packaging

“SK hynix is collaborating with Intel to utilize its Embedded Multi-die Interconnect Bridge (EMIB) 2.5D packaging technology for HBM memory. As SK hynix aims to diversify its supply chain and customers are increasingly considering Intel Foundry, the South Korean memory giant is exploring research and development efforts with Intel on 2.5D packaging technology. Intel's premier 2.5D packaging technology is its EMIB, which interconnects multiple silicon dies using bridges embedded in a packaging substrate. SK hynix is interested in integrating this technology into its HBM memory, presumably to bring its HBM4 memory modules up to standard for EMIB integration, should its AI chip partners choose Intel Foundry for advanced packaging of their next-generation solutions.” Source: https://www.techpowerup.com/348926/sk-hynix-eyes-intel-emib-2-5d-packaging-for-hbm-memory?amp