Q1 2026 sequential sales growth expected high single digits
Guidance · revenue to $5.07B
Qnity Electronics reported strong Q4 2025 results with 8% revenue growth, driven by advanced packaging and interconnect solutions. Management's 2026 guidance reflects continued but slightly moderating growth momentum. Q4 2025 net sales of $1.2B, up 8% YoY
Qnity Electronics reported strong Q4 2025 results with 8% revenue growth, driven by advanced packaging and interconnect solutions. Management's 2026 guidance reflects continued but slightly moderating growth momentum. Q4 2025 net sales of $1.2B, up 8% YoY
Guidance · revenue to $5.07B
Guidance · revenue to $5.07B
Management expressed strong conviction in growth drivers, highlighted record POR wins and capacity expansions, and provided upbeat 2026 guidance despite market uncertainties.
Reported gross margin was 41.85%, reinforcing the quarter's better-than-guided profitability.
Management highlighted strong AI-driven demand across advanced nodes, advanced packaging, and memory (HBM), with data centers as the primary growth driver. They emphasized materials innovation as key to enabling the next AI leap, and AI-related content growth in both segments, including thermal management and advanced interconnects.
Advanced packaging represents ~10% of net sales. Management expressed strong conviction in growth drivers, highlighted record POR wins and capacity expansions, and provided upbeat 2026 guidance despite market uncertainties.
CUNY plans to elevate 2026 CapEx to 9% of sales (above normalized 6%) to support advanced node ramps, local-for-local footprint expansions, and transformation initiatives. They expect CapEx to return to ~6% in future years, with mid-teens free cash flow margins thereafter.
Management expressed strong conviction in growth drivers, highlighted record POR wins and capacity expansions, and provided upbeat 2026 guidance despite market uncertainties.
“In 2025, advanced packaging solutions represented approximately 10% of CUNY net sales.”
“The key here is that our exposure is primarily to premium devices, which we expect to be a more resilient part of the market.”
| Metric | Period | Range | Midpoint | Status |
|---|---|---|---|---|
| EPS | FY2026 | $3.55–$3.95inline vs consensus | $3.75 | MAINTAINED |
| Op margin | FY2026 | 26%–28%inline vs consensus | 27% | GUIDED |
| Revenue | FY2026 | $4.97B–$5.17Binline vs consensus | $5.07B | MAINTAINED |
HBM memory supply is becoming a key constraint; the reporting company's exposure is primarily to 'premium devices' which are expected to be more resilient, but the company is closely monitoring potential downstream impacts and demand from the HBM market. — Indicates a potential risk to Qnity's growth if HBM supply becomes too tight and drives down demand for premium devices, but also highlights Qnity's focus on high-end content.
“in memory, we're seeing next-generation DRAM and HBM, as well as transitions to higher layer count NAND architectures.”
… necessary to support the strong advanced node ramp activity we expect in 2026 and beyond. Given this surge in activity, I'd like to share some more details on what we're currently seeing in each of our segments and how we expect our end markets to evolve in 2026. In SEMI, customers continue to invest in their most advanced technologies. In advanced logic, this includes the continued scaling of three nanometer and early production of 2 nanometer. In memory, we're seeing next-generation DRAM and HBM, as well as transitions to higher layer count NAND architectures. We remain ideally positioned to capitalize on this shift through both the increased use of more complex 3D structures and the adoption of more chip layers, giving us a stable, repeatable revenue stream as production volumes increase. In ICS, advanced packaging continues to be a core theme of every recent customer conversation because of the central role it plays in unlocking next-generation technologies, including increasing chip density and performance while also reducing power consumption, facilitating development of smaller, more efficient devices. One of the reasons CUNY is so well positioned to capture meaningful …
Advanced packaging exposure is only ~10% of Qnity net sales, but is growing >20% and is one of the key growth drivers for 2026, indicating a significant content TAM expansion adjacent to the core semi business. — Indicates advanced packaging is a critical growth engine for the entire semiconductor supply chain, not just Qnity, and suggests supply chain adjustments are underway to support this growth.
… packaging continues to be a core theme of every recent customer conversation because of the central role it plays in unlocking next-generation technologies, including increasing chip density and performance while also reducing power consumption, facilitating development of smaller, more efficient devices. One of the reasons CUNY is so well positioned to capture meaningful growth in advanced packaging is because it integrates solutions from both SEMI and ICF. In 2025, advanced packaging solutions represented approximately 10% of CUNY net sales. From an end market perspective, our portfolio continues to evolve based on more durable structural demand shifts. data centers are where we're seeing the most benefit from these dynamics. However, we're also seeing continued signs of increasing content and demand recovery in other industrial markets like automotive, communication infrastructure, and aerospace and defense. As these end markets start to incorporate more advanced AI-driven technology into applications, we expect meaningful opportunities to continue increasing CUNY's content. On the consumer side, next-generation devices are increasingly shifting towards edge computing, …
The imaging materials market is projected to reach USD 4.2 billion by 2029, with a CAGR of 8.4%, according to a new report by MarketsandMarkets. — Highlights a broader market trend and growth in the semiconductor materials sector, which could impact Qnity's competitive positioning.